WNX - PROPERTIES AND APPLICATIONS

被引：46

作者：

SO, FCT

KOLAWA, E

ZHAO, XA

NICOLET, MA

机构：

来源：

关键词：

D O I：

10.1016/0040-6090(87)90210-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：507 / 520

页数：14

共 25 条

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[2] DEVELOPMENT OF THE SELF-ALIGNED TITANIUM SILICIDE PROCESS FOR VLSI APPLICATIONS
ALPERIN, ME
HOLLAWAY, TC
HAKEN, RA
GOSMEYER, CD
KARNAUGH, RV
PARMANTIE, WD
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (02) : 141 - 149
[3] GROWTH OF SELECTIVE TUNGSTEN ON SELF-ALIGNED TI AND PTNI SILICIDES BY LOW-PRESSURE CHEMICAL VAPOR-DEPOSITION
BROADBENT, EK
MORGAN, AE
DEBLASI, JM
VANDERPUTTE, P
COULMAN, B
BURROW, BJ
SADANA, DK
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (08) : 1715 - 1721
[4] THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS
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VONSEEFELD, H
NICOLET, MA
HO, F
ILES, P
[J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) : 4297 - 4299
[5] CHEUNG NW, 1980, THESIS CALTECH
[6] COLGAN EG, 1987, THESIS CORNELL U
[7] INVESTIGATION OF REACTIVELY SPUTTERED TIN FILMS FOR DIFFUSION-BARRIERS
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[J]. THIN SOLID FILMS, 1986, 136 (02) : 195 - 214
[8] CHARACTERIZATION OF REACTED OHMIC CONTACTS TO GAAS
KATTELUS, HP
TANDON, JL
NICOLET, MA
[J]. SOLID-STATE ELECTRONICS, 1986, 29 (09) : 903 - 905
[9] SPUTTERED W-N DIFFUSION-BARRIERS
KATTELUS, HP
KOLAWA, E
AFFOLTER, K
NICOLET, MA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06): : 2246 - 2254
[10] BIAS-INDUCED STRESS TRANSITIONS IN SPUTTERED TIN FILMS
KATTELUS, HP
TANDON, JL
SALA, C
NICOLET, MA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (04): : 1850 - 1854