BASIC PHENOMENA IN REACTIVE LOW-PRESSURE PLASMAS USED FOR DEPOSITION AND ETCHING - CURRENT STATUS

被引:46
作者
TURBAN, G
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D O I
10.1351/pac198456020215
中图分类号
O6 [化学];
学科分类号
0703 ;
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页码:215 / 230
页数:16
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