Flip Chip Bonding of 68 X 68 MWIR LED Arrays

被引：11

作者：

Das, Naresh Chandra ^{[1
]}

Taysing-Lara, Monica ^{[1
]}

Olver, Kimberley Anderson ^{[2
]}

Kiamilev, Fouad ^{[3
]}

Prineas, J. P. ^{[4
]}

Olesberg, J. T. ^{[4
]}

Koerperick, E. J. ^{[4
]}

Murray, L. M. ^{[4
]}

Boggess, Tom F. ^{[4
]}

机构：

[1] USA, Microphoton Branch, Res Lab, Adelphi, MD 20783 USA

[2] USA, EO IR Mat & Devices Branch, Res Lab, Adelphi, MD 20783 USA

[3] Univ Delaware, Dept Elect Engn, Newark, DE 19716 USA

[4] Univ Iowa, Dept Phys, Iowa City, IA 52242 USA

来源：

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2009年 / 32卷 / 01期

关键词：

CMOS drivers; contact resistance; flip chip bonding; led array; OHMIC CONTACTS;

D O I：

10.1109/TEPM.2008.2005062

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The flip chip bonding process is optimized by varying the bonding pressure, temperature, and time. The 68 x 68 mid wave infrared (MWIR) LED array was hybridized onto Si-CMOS driver array with same number of pixels. Each pixel has two indium bumps, one for cathode and another for anode. Both LED array and CMOS drivers have 15-mu m-square Indium bump contact pads. We used Karl Suss FC150 flip chip machine for bonding of CMOS driver array onto LED array. From the LED current-voltage characteristics, it is concluded that the optimized flip chip bonding process results in uniform contact and very low contact resistance. Both electrical and optical characteristics of LED array after flip chip bonding are presented.

引用

页码：9 / 13

页数：5

共 12 条

[1] Dynamic IR scene projector based upon the digital micromirror device [J].

Beasley, DB ;

Bender, M ;

Crosby, J ;

Messer, T ;

Saylor, DA .

TECHNOLOGIES FOR SYNTHETIC ENVIRONMENTS: HARDWARE-IN-THE-LOOP TESTING VI, 2001, 4366 :96-102

[2] Nitride-based flip-chip LEDs with transparent ohmic contacts and reflective mirrors [J].

Chang, S. J. ;

Chen, W. S. ;

Lin, Y. C. ;

Chang, C. S. ;

Ko, T. K. ;

Hsu, Y. P. ;

Shen, C. F. ;

Tsai, J. M. ;

Shei, S. C. .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (03) :403-408

[3] Nitride-based flip-chip ITO LEDs [J].

Chang, SJ ;

Chang, CS ;

Su, YK ;

Lee, CT ;

Chen, WS ;

Shen, CF ;

Hsu, YP ;

Shei, SC ;

Lo, HM .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (02) :273-277

[4] Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems [J].

Chu, KM ;

Lee, JS ;

Cho, HS ;

Rho, BS ;

Park, HH ;

Jeon, DY .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2004, 43 (8B) :5922-5927

[5] Performance of mid-wave infrared (3.8 μm) light emitting diode device [J].

Das, N. C. ;

Tobin, M. S. .

SOLID-STATE ELECTRONICS, 2006, 50 (9-10) :1612-1617

[6] Infrared (3.8 μm) interband cascade light-emitting diode array with record high efficiency -: art. no. 041105 [J].

Das, NC ;

Olver, K ;

Towner, F ;

Simonis, G ;

Shen, H .

APPLIED PHYSICS LETTERS, 2005, 87 (04)

[7] Low resistance and high reflectance Pt/Rh contacts to p-type GaN for GaN-based flip chip light-emitting diodes [J].

Lee, JR ;

Na, SI ;

Jeong, JH ;

Lee, SN ;

Jang, JS ;

Lee, SH ;

Jung, JJ ;

Song, JO ;

Seong, TY ;

Park, SJ .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (01) :G92-G94

[8] Microshutter array development for the James Webb space telescope [J].

Li, MJ ;

Acuna, N ;

Amatucci, E ;

Beamesderfer, M ;

Boucarut, R ;

Babu, S ;

Bajikar, S ;

Ewin, A ;

Fettig, R ;

Franz, D ;

Hess, L ;

Hu, R ;

Jhabvala, M ;

Kelly, D ;

King, T ;

Kletetschka, G ;

Kotechi, C ;

Kutyrev, A ;

Loughlin, J ;

Lynch, BA ;

Moseley, H ;

Mott, B ;

Newell, B ;

Oh, L ;

Rapchun, D ;

Ray, C ;

Sappington, C ;

Schulte, E ;

Schwinger, S ;

Smith, W ;

Snodgrass, S ;

Sparr, L ;

Steptoe-Jackson, R ;

Wang, LQ ;

Zheng, Y ;

Zincke, C .

MICRO- AND NANOTECHNOLOGY: MATERIALS, PROCESSES, PACKAGING, AND SYSTEMS II, 2005, 5650 :9-16

[9]

Long JP, 2002, OPTO-ELECTRON REV, V10, P251

[10] 320x256 solar-blind focal plane arrays based on AlxGa1-xN -: art. no. 011117 [J].

McClintock, R ;

Mayes, K ;

Yasan, A ;

Shiell, D ;

Kung, P ;

Razeghi, M .

APPLIED PHYSICS LETTERS, 2005, 86 (01) :011117-1

← 1 2 →