High-field transport of inversion-layer electrons and holes including velocity overshoot

被引:26
作者
Assaderaghi, F
Sinitsky, D
Bokor, J
Ko, PK
Gaw, H
Hu, CM
机构
[1] UNIV CALIF BERKELEY, DEPT ELECT ENGN & COMP SCI, BERKELEY, CA 94720 USA
[2] INTEL CORP, SANTA CLARA, CA 95051 USA
关键词
D O I
10.1109/16.563373
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we experimentally address the effect of a wide range of parameters on the high-held transport of inversion-layer electrons and heres, The studied parameters include substrate doping level, surface micro-roughness, vertical field strength, nitridation of the gate oxide, and device channel length. We employ special test structures built on Silicon-On-Insulator (SOI) and bulk wafers to accurately measure the high-held drift velocity of inversion-layer carriers, Our findings point to electron velocity overshoot at room temperature, dependence of electron and hole saturation velocities on nitridation of the gate oxide, dependence of the high-field drift velocity on the effective vertical held, and relative insensitivity of electron and hole mobility and saturation velocity to moderate surface roughness.
引用
收藏
页码:664 / 671
页数:8
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