Characteristics of polysilicon thin-film transistor with thin-gate dielectric grown by electron cyclotron resonance nitrous oxide plasma

被引:11
作者
Lee, JW [1 ]
Lee, NI [1 ]
Han, JI [1 ]
Han, CH [1 ]
机构
[1] SAMSUNG ELECT CO LTD,KYONGGI DO,SOUTH KOREA
关键词
Dielectric devices - Electric breakdown of solids - Electron cyclotron resonance - Film growth - Interfaces (materials) - Nitrogen oxides - Oxidation - Passivation - Semiconductor growth - Thin film devices;
D O I
10.1109/55.568751
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Polysilicon thin-film transistors (poly-Si TFT's) with thin-gate oxide grown by electron cyclotron resonance (ECR) nitrous oxide (N2O)-plasma oxidation is presented, ECR N2O-plasma oxidation successfully incorporates nitrogen atoms at the SiO2/poly-Si interface, consequently forms a nitrogen-rich layer with Si = N bonds at a binding energy of 397.8 eV, ECR N2O-plasma oxide grown on poly-Si films shows higher breakdown fields than thermal oxide. The fabricated poly-Si TFT's with N2O-plasma oxide show better performance than those with ECR O-2-plasma oxide, which results not only front the smooth interface but also oxygen- and nitrogen-plasma passivation.
引用
收藏
页码:172 / 174
页数:3
相关论文
共 11 条
[1]   A SIMPLE EEPROM CELL USING TWIN POLYSILICON THIN-FILM TRANSISTORS [J].
CAO, M ;
ZHAO, TM ;
SARASWAT, KC ;
PLUMMER, JD .
IEEE ELECTRON DEVICE LETTERS, 1994, 15 (08) :304-306
[2]   CURRENT STATUS AND FUTURE-PROSPECTS OF POLY-SI DEVICES [J].
CLARK, MG .
IEE PROCEEDINGS-CIRCUITS DEVICES AND SYSTEMS, 1994, 141 (01) :3-8
[3]  
HEDGE RI, 1995, APPL PHYS LETT, V66, P2882
[4]  
KOYAMA S, 1992, P S VLSI TECHNOLOGY, P44
[5]  
LEE JC, 1988, IEEE T ELECT DEV, V35, P1603
[6]  
LEE JW, 1995, P MAT RES SOC SPRING, P441
[7]  
LEE JY, 1994, INTERNATIONAL ELECTRON DEVICES MEETING 1994 - IEDM TECHNICAL DIGEST, P523, DOI 10.1109/IEDM.1994.383354
[8]   EFFECTS OF ELECTRON-CYCLOTRON-RESONANCE PLASMA THERMAL-OXIDATION ON THE PROPERTIES OF POLYCRYSTALLINE SILICON FILM [J].
LEE, JY ;
HAN, CH ;
KIM, CK ;
KIM, BK .
APPLIED PHYSICS LETTERS, 1995, 67 (13) :1880-1882
[9]   THE IMPACT OF SCALING-DOWN OXIDE THICKNESS ON POLY-SI THIN-FILM TRANSISTORS IV CHARACTERISTICS [J].
LIN, PS ;
LI, TS .
IEEE ELECTRON DEVICE LETTERS, 1994, 15 (04) :138-139
[10]   THE EFFECTS OF NH3 PLASMA PASSIVATION ON POLYSILICON THIN-FILM TRANSISTORS [J].
WANG, FS ;
TSAI, MJ ;
CHENG, HC .
IEEE ELECTRON DEVICE LETTERS, 1995, 16 (11) :503-505