A novel structural amorphous fluoropolymer film with an ultra-low dielectric constant

被引:29
作者
Ding, SJ
Wang, PF
Zhang, DW [1 ]
Wang, JT
Lee, WW
机构
[1] Fudan Univ, Dept Elect Engn, Shanghai 200433, Peoples R China
[2] Taiwan Semicond Mfg Co, Hsinchu, Taiwan
基金
中国国家自然科学基金;
关键词
amorphous fluoropolymer; dielectric constant; film; novel structure; spin coating; pore; phase separation;
D O I
10.1016/S0167-577X(00)00360-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Amorphous fluoropolymer (AF) thin Nm (0.9-1 mum), which has no-pinhole and uniform surface and numerous pores in the matrix, has been prepared from a solution of Teflon AF 1600 by a spin-coating method. Thermal annealing at 400 degreesC for 30 min does not cause obvious deterioration of the film surface morphology. The mechanism for the formation of the film with a novel structure is discussed. By capacitance-voltage (C-V) and current-voltage (I-V) measurements, the electricity properties of the AF film are defined. The substitution of SiO2 (k = 4.0) with the AF film (k = 1.57) will decrease the resistance-capacitance (RC) delay by about 61%. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:154 / 159
页数:6
相关论文
共 21 条
[1]   DEPOSITION OF AMORPHOUS FLUOROPOLYMERS THIN-FILMS BY LASER ABLATION [J].
BLANCHET, GB .
APPLIED PHYSICS LETTERS, 1993, 62 (05) :479-481
[2]  
Bohr MT, 1995, INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST, P241, DOI 10.1109/IEDM.1995.499187
[3]   ANALYSIS OF THE EFFECTS OF SCALING ON INTERCONNECT DELAY IN ULSI CIRCUITS [J].
BOTHRA, S ;
ROGERS, B ;
KELLAM, M ;
OSBURN, CM .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (03) :591-597
[4]  
CARTER KR, 1995, MATER RES SOC SYMP P, V381, P79, DOI 10.1557/PROC-381-79
[5]   Plasma deposition of low-dielectric-constant fluorinated amorphous carbon [J].
Endo, K ;
Shinoda, K ;
Tatsumi, T .
JOURNAL OF APPLIED PHYSICS, 1999, 86 (05) :2739-2745
[6]   Aerogels: Production, characterization, and applications [J].
Fricke, J ;
Tillotson, T .
THIN SOLID FILMS, 1997, 297 (1-2) :212-223
[7]   Nanoporous silica as an ultralow-k dielectric [J].
Jin, CM ;
Luttmer, JD ;
Smith, DM ;
Ramos, TA .
MRS BULLETIN, 1997, 22 (10) :39-42
[8]   Low k, porous methyl silsesquioxane and spin-on-glass [J].
Kohl, AT ;
Mimna, R ;
Shick, R ;
Rhodes, L ;
Wang, ZL ;
Kohl, PA .
ELECTROCHEMICAL AND SOLID STATE LETTERS, 1999, 2 (02) :77-79
[9]   Low-dielectric-constant materials for ULSI interlayer-dielectric applications [J].
Lee, WW ;
Ho, PS .
MRS BULLETIN, 1997, 22 (10) :19-24
[10]  
LIMB SJ, 1998, J VAC SCI TECHNOL A, V15, P1614