Deposition of molybdenum thin films by an alternate supply of MoCl5 and Zn

被引：41

作者：

Juppo, M ^{[1
]}

Vehkamaki, M ^{[1
]}

Ritala, M ^{[1
]}

Leskela, M ^{[1
]}

机构：

[1] Univ Helsinki, Dept Chem, FIN-00014 Helsinki, Finland

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1998年 / 16卷 / 05期

关键词：

D O I：

10.1116/1.581430

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Molybdenum thin films were deposited onto both soda lime glass and Al2O3 film by an alternate supply of MoCl5 and Zn. Zinc was used as a reducing agent. The film growth was performed over a temperature range of 400-500 degrees C in order to study the temperature effect on the growth. In addition to the growth temperature, the purge length after zinc was also seen to have a considerable effect on the growth. The films were analyzed by energy dispersive x-ray spectroscopy, scanning electron microscopy, elastic recoil detection analysis, x-ray diffraction and four point resistance measurements in order to determine their chemical and physical characteristics. (C) 1998 American Vacuum Society. [S0734-2101(98)01405-5].

引用

页码：2845 / 2850

页数：6

共 26 条

[1]

[Anonymous], 1993, OUT HSC CHEM WIND PR

[2]

[Anonymous], 1988, Microbeam Analysis

[3]

CARVER GE, 1979, THIN SOLID FILMS, V63, P169, DOI 10.1016/0040-6090(79)90121-4

[4] CHEMICAL VAPOR DEPOSITION OF MO ONTO SI [J].

CASEY, JJ ;

VERDERBE.RR ;

GARNACHE, RR .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1967, 114 (2P1) :201-&

[5]

*CHEM RUBB, 1971, HDB CHEM PHYS, pE91

[6] CHARACTERIZATION OF CVD MOLYBDENUM THIN FILMS [J].

ELHOSHY, AH .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (12) :2028-&

[7] MOLYBDENUM COATING OF VANADIUM BY CHEMICAL VAPOR-DEPOSITION [J].

FUKUTOMI, M ;

OKADA, M ;

WATANABE, R .

JOURNAL OF THE LESS-COMMON METALS, 1976, 48 (01) :65-77

[8] ENCAPSULATED COPPER INTERCONNECTION DEVICES USING SIDEWALL BARRIERS [J].

GARDNER, DS ;

ONUKI, J ;

KUDOO, K ;

MISAWA, Y ;

VU, QT .

THIN SOLID FILMS, 1995, 262 (1-2) :104-119

[9] Analysis of AlN thin films by combining TOF-ERDA and NRB techniques [J].

Jokinen, J ;

Haussalo, P ;

Keinonen, J ;

Ritala, M ;

Riihela, D ;

Leskela, M .

THIN SOLID FILMS, 1996, 289 (1-2) :159-165

[10] Deposition of copper films by an alternate supply of CuCl and Zn [J].

Juppo, M ;

Ritala, M ;

Leskela, M .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1997, 15 (04) :2330-2333

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