共 9 条
[2]
Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
1999, 22 (02)
:299-306
[3]
Ni electroless plating process for solder bump chip on glass technology
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
1997, 36 (4A)
:2091-2095
[5]
Electroless nickel bumping of aluminum bondpads - Part I: Surface pretreatment and activation
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2002, 25 (01)
:87-97
[6]
Electroless nickel bumping of aluminum bondpads - Part II: Electroless nickel plating
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2002, 25 (01)
:98-105
[7]
A BIOSENSOR THAT MONITORS CELL MORPHOLOGY WITH ELECTRICAL FIELDS
[J].
IEEE ENGINEERING IN MEDICINE AND BIOLOGY MAGAZINE,
1994, 13 (03)
:402-408