A lumped transient thermal model for self-heating in MOSFETs

被引:20
作者
Sabry, MN
Fikry, W
Salam, KA
Awad, MM
Nasser, AE
机构
[1] Mentor Graph Egypt, Cairo, Egypt
[2] Mansoura Univ, Dept Mech Engn, Mansoura, Egypt
来源
MICROELECTRONICS JOURNAL | 2001年 / 32卷 / 10-11期
关键词
MOSFET; thermal modeling; self-heating;
D O I
10.1016/S0026-2692(01)00072-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 [电气工程]; 0809 [电子科学与技术];
摘要
Both static and dynamic effects related to self-heating in MOSFETs (metal-oxide-silicon field effect transistors) are studied in order to construct an adequate compact thermal model. An available 2D electrical device simulator in addition to a simple 2D finite difference code for the heat equation are used as analysis tools. These tools are used both to justify the proposed model topology as well as to extract model parameters. Both static and dynamic effects predicted by the model are compared with existing experimental results. (C) 2001 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:847 / 853
页数:7
相关论文
共 18 条
[1]
THETA-JC CHARACTERIZATION OF CHIP PACKAGES - JUSTIFICATION, LIMITATIONS, AND FUTURE [J].
BARCOHEN, A ;
ELPERIN, T ;
ELIASI, R .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04) :724-731
[2]
AN ANALYTICAL DRAIN CURRENT MODEL CONSIDERING BOTH ELECTRON AND LATTICE TEMPERATURES SIMULTANEOUSLY FOR DEEP-SUBMICRON ULTRATHIN SOI NMOS DEVICES WITH SELF-HEATING [J].
CHEN, YG ;
MA, SY ;
KUO, JB ;
YU, ZP ;
DUTTON, RW .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1995, 42 (05) :899-906
[3]
Propagation analysis for thermal modeling [J].
de Cogan, D .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (03) :418-423
[4]
Fully coupled dynamic electro-thermal simulation [J].
Digele, G ;
Lindenkreuz, S ;
Kasper, E .
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 1997, 5 (03) :250-257
[5]
Thermal characterization of electronic devices with boundary condition independent compact models [J].
Lasance, CJM ;
Vinke, H ;
Rosten, H .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (04) :723-731
[6]
Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software [J].
Lasance, CJM ;
den Hertog, D ;
Stehouwer, P .
FIFTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 1999, :189-200
[7]
MAUTRY PG, 1990, P IEEE INT C MICR TE, V3, P21
[8]
Static and dynamic thermal modeling of ICs [J].
Sabry, MN .
MICROELECTRONICS JOURNAL, 1999, 30 (11) :1085-1091
[9]
Realistic and efficient simulation of electro-thermal effects in VLSI circuits [J].
Sabry, MN ;
Bontemps, A ;
Aubert, V ;
Vahrmann, R .
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 1997, 5 (03) :283-289
[10]
THE EVOLUTION OF THE MINIMOS MOBILITY MODEL [J].
SELBERHERR, S ;
HANSCH, W ;
SEAVEY, M ;
SLOTBOOM, J .
SOLID-STATE ELECTRONICS, 1990, 33 (11) :1425-1436