Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints

被引：21

作者：

Liang, S. W. ^{[1
]}

Chiu, S. H. ^{[1
]}

Chen, Chih ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30050, Taiwan

来源：

APPLIED PHYSICS LETTERS | 2007年 / 90卷 / 08期

关键词：

D O I：

10.1063/1.2644061

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

This study investigates the mechanism for the abrupt increase in temperature at later stages of electromigration in flip-chip solder joints. It is found that electromigration also occurs in Al traces when stressed by 0.6 A at 100 degrees C. Three-dimensional thermoelectrical simulation by finite element analysis was carried out to simulate the temperature distribution in solder joints with and without degradation of the Al trace. It is found that the degradation of the Al trace has substantial effect on the Joule heating of solder joints. This model can explain the serious Joule heating effect in the later stages of electromigration. (c) 2007 American Institute of Physics.

引用

页数：3

共 11 条

[1] High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints [J].

Alam, MO ;

Wu, BY ;

Chan, YC ;

Tu, KN .

ACTA MATERIALIA, 2006, 54 (03) :613-621

[2] Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration [J].

Chiu, SH ;

Shao, TL ;

Chen, C ;

Yao, DJ ;

Hsu, CY .

APPLIED PHYSICS LETTERS, 2006, 88 (02) :1-3

[3] Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization [J].

Hsu, YC ;

Shao, TL ;

Yang, CJ ;

Chen, C .

JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (11) :1222-1227

[4] ELECTROMIGRATION FAILURE DUE TO INTERFACIAL DIFFUSION IN FINE AL-ALLOY LINES [J].

HU, CK ;

SMALL, MB ;

RODBELL, KP ;

STANIS, C ;

BLAUNER, P ;

HO, PS .

APPLIED PHYSICS LETTERS, 1993, 62 (09) :1023-1025

[5] Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps [J].

Hu, CK ;

Gignac, L ;

Liniger, E ;

Herbst, B ;

Rath, DL ;

Chen, ST ;

Kaldor, S ;

Simon, A ;

Tseng, WT .

APPLIED PHYSICS LETTERS, 2003, 83 (05) :869-871

[6] Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints [J].

Huang, Annie T. ;

Tu, K. N. ;

Lai, Yi-Shao .

JOURNAL OF APPLIED PHYSICS, 2006, 100 (03)

[7]

Justison PatrickR., 2001, APPL PHYS LETT, V79, P3236

[8]

LAING SW, 2006, APPL PHYS LETT, V89

[9]

*SEM IND ASS, 2003, INT TECHN ROADM SEM, P4

[10] Local melting induced by electromigration in flip-chip solder joints [J].

Tsai, C. M. ;

Lin, Y. L. ;

Tsai, J. Y. ;

Lai, Yi-Shao ;

Kao, C. R. .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) :1005-1009

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