Failure modes and mechanisms of InP-based and metamorphic high electron mobility transistors

被引:31
作者
Meneghesso, G
Zanoni, E
机构
[1] Univ Padua, Dipartimento Elettron & Informat, I-35131 Padua, Italy
[2] INFM, I-35131 Padua, Italy
关键词
D O I
10.1016/S0026-2714(02)00045-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reviews most recent results concerning reliability of InP-based and metamorphic high electron mobility transistors (HEMTs). Thanks to research work carried out in the last 10 years, a deeper understanding of failure mechanisms of these devices has been achieved, and process and technology solutions have been found for the control of premature breakdown (related to the reduced energy gap of InGaAs) and of parasitic effects, such as "kink" effects, and transconductance frequency dispersion. After a brief description of impact-ionization effects in InGaAs, an analysis of failure modes and mechanisms of InP and metamorphic HEMTs is carried out, including hot-carrier-induced degradation, gate sinking and Schottky/ohmic contact interdiffusion, hydrogen effects, and donor compensation due to fluorine atoms indiffusion. Results show that reliability of these devices is continuously improving, opening the way for applications in microwave and millimeter-wave systems. (C) 2002 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:685 / 708
页数:24
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