Comparison of texture evolution in Ag and Ag(Al) alloy thin films on amorphous SiO2

被引：83

作者：

Kim, HC ^{[1
]}

Theodore, ND ^{[1
]}

Alford, TL ^{[1
]}

机构：

[1] Arizona State Univ, Dept Chem & Mat Engn, Tempe, AZ 85287 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2004年 / 95卷 / 09期

关键词：

D O I：

10.1063/1.1682685

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The thermal stability of Ag metallization on SiO2 was improved by using Ag(Al) alloy films instead of pure Ag thin films which agglomerate at high temperature. X-ray diffraction techniques were used to study the texture evolution of Ag and Ag(Al) films. Different behaviors were observed in texture evolution of Ag and Ag(Al) films. Detailed information about the texture of Ag and Ag(Al) films was obtained by performing pole-figure analysis. Two different changes in texture are explained using a grain-growth mechanism and an agglomeration phenomenon, both of which work to reduce the total free energy of the system at high temperature. Based on the data obtained in this study, the texture evolution of Ag film, induced by agglomeration, and Ag(Al) film is discussed. (C) 2004 American Institute of Physics.

引用

页码：5180 / 5188

页数：9

共 33 条

[1] Correlation between texture and average grain size in polycrystalline Ag thin films [J].

Adamik, M ;

Barna, PB ;

Tomov, I .

THIN SOLID FILMS, 2000, 359 (01) :33-38

[2] Stability of silver thin films on various underlying layers at elevated temperatures [J].

Alford, TL ;

Chen, LH ;

Gadre, KS .

THIN SOLID FILMS, 2003, 429 (1-2) :248-254

[3]

[Anonymous], 1992, SMITHELLS METALS REF

[4] Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates [J].

Gadre, KS ;

Alford, TL .

JOURNAL OF APPLIED PHYSICS, 2003, 93 (02) :919-923

[5] Applicability of the broken-bond rule to the surface energy of the fcc metals [J].

Galanakis, I ;

Papanikolaou, N ;

Dederichs, PH .

SURFACE SCIENCE, 2002, 511 (1-3) :1-12

[6] Abnormal growth of "giant" grains in silver thin films [J].

Greiser, J ;

Müllner, P ;

Arzt, E .

ACTA MATERIALIA, 2001, 49 (06) :1041-1050

[7] Growth of giant grains in silver thin films [J].

Greiser, J ;

Müller, D ;

Müllner, P ;

Thompson, CV ;

Arzt, E .

SCRIPTA MATERIALIA, 1999, 41 (07) :709-714

[8] Void formation and electromigration in sputtered Ag lines with different encapsulations [J].

Hauder, M ;

Gstöttner, J ;

Hansch, W ;

Schmitt-Landsiedel, D .

SENSORS AND ACTUATORS A-PHYSICAL, 2002, 99 (1-2) :137-143

[9] Electromigration resistance of sputtered silver lines using different patterning techniques [J].

Hauder, M ;

Hansch, W ;

Gstöttner, J ;

Schmitt-Landsiedel, D .

MICROELECTRONIC ENGINEERING, 2002, 60 (1-2) :51-57

[10] Improvement of the thermal stability of silver metallization [J].

Kim, HC ;

Alford, TL .

JOURNAL OF APPLIED PHYSICS, 2003, 94 (08) :5393-5395

← 1 2 3 4 →