Evaluation of pressure uniformity using a pressure-sensitive film and calculation of wafer distortions caused by mold press in imprint lithography

In order to simply evaluate the uniformity of imprint pressure across a large imprint area instead of measuring critical dimension and/or height of imprinted patterns. we propose a new method using a pressure-sensitive film that changes color according to the intensity of pressure. Degradation factors of pressure uniformity will be investigated by measuring color density at multiple points on the pressed film and their mitigating factors will be discussed. Simulation using a finite element method will also clarify that wafer distortions caused by imprint pressure applied to a limited area of a wafer should not be negligible for uniform press and accurate pattern placement.