Metal deposition onto a porous silicon layer by immersion plating from aqueous and nonaqueous solutions

Immersion plating of metals (Ag, Cu, Ni) onto a porous silicon (PS) layer from aqueous and nonaqueous solutions has been studied. The modified PS layers after the immersion plating were analyzed by X-ray diffraction and X-ray photoelectron spectroscopy. Fourier transform infrared spectroscopy and scanning electron microscopy were also performed to investigate the structural changes and microstructure of PS samples after the plating process. In both solutions, the deposition of metal oxidizes PS simultaneously to SiO2. The different deposition behaviors are discussed in terms of different rest potentials of PS in these solutions and electrode potential of each metal. Immersion plating in nonaqueous organic solutions shows that a trace of residual water affects the metal deposition. Based on the results obtained, the mechanism of metal deposition is proposed. The metal deposition proceeds by nucleation and growth via the local cell mechanism. It is also found that metal deposition proceeds very differently on Si wafer and PS surfaces. The different deposition behaviors on both surfaces are discussed. (C) 2002 The Electrochemical Society.