Epitaxial oxide thin films on Si(001)

被引:101
作者
Yu, Z
Ramdani, J
Curless, JA
Overgaard, CD
Finder, JM
Droopad, R
Eisenbeiser, KW
Hallmark, JA
Ooms, WJ
Kaushik, VS
机构
[1] Motora Labs, Phys Sci Res Labs, Tempe, AZ 85284 USA
[2] Motorola Digital DNA Labs, Austin, TX 78721 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2000年 / 18卷 / 04期
关键词
D O I
10.1116/1.1303737
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Over the years, the development of epitaxial oxides on silicon has been a great technological challenge. Amorphous silicon oxide layer forms quickly at the interface when the Si surface is exposed to oxygen, making the intended oxide heteroepitaxy on Si substrate extremely difficult. Epitaxial oxides such as BaTiO3 (BTO) and SrTiO3 (STO) integrated with Si are highly desirable for future generation transistor gate dielectric and ferroelectric memory cell applications. In this article, we review the recent progress in the heteroepitaxy of oxide thin films on Si(001) substrate by using the molecular beam epitaxy technique at Motorola Labs. Structural, interfacial and electrical properties of the oxide thin films on Si have been characterized using in situ reflection high energy electron diffraction, x-ray diffraction, spectroscopic ellipsometry, atomic force microscopy, Auger electron spectroscopy, x-ray photoelectron spectroscopy, high-resolution transmission electron microscopy, high-resolution transmission electron energy loss spectroscopy, capacitance-voltage and current-voltage measurement. We also present the transistor results and address the impact of the epitaxial oxide films on future generation metal-oxide-semiconductor field effect transistors. (C) 2000 American Vacuum Society. [S0734-211X(00)00504-7].
引用
收藏
页码:2139 / 2145
页数:7
相关论文
共 36 条
[1]   Electric-field penetration into metals: Consequences for high-dielectric-constant capacitors [J].
Black, CT ;
Welser, JJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (04) :776-780
[2]   The impact of high-κ gate dielectrics and metal gate electrodes on sub-100 nm MOSFET's [J].
Cheng, BH ;
Cao, M ;
Rao, R ;
Inani, A ;
Voorde, PV ;
Greene, WM ;
Stork, JMC ;
Yu, ZP ;
Zeitzoff, PM ;
Woo, JCS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (07) :1537-1544
[3]   MOS C-V characterization of ultrathin gate oxide thickness (1.3-1.8 nm) [J].
Choi, CH ;
Goo, JS ;
Oh, TY ;
Yu, ZP ;
Dutton, RW ;
Bayoumi, A ;
Cao, M ;
Vande Voorde, P ;
Vook, D ;
Diaz, CH .
IEEE ELECTRON DEVICE LETTERS, 1999, 20 (06) :292-294
[4]   HETEROEPITAXIAL GROWTH OF YTTRIA-STABILIZED ZIRCONIA (YSZ) ON SILICON [J].
FUKUMOTO, H ;
IMURA, T ;
OSAKA, Y .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1988, 27 (08) :L1404-L1405
[5]  
HALLMARK J, IN PRESS INTEGR FERR
[6]  
HAUSER JR, 1998 INT C, P235
[7]   A 1.1 nm oxide equivalent gate insulator formed using TiO2 on nitrided silicon [J].
He, B ;
Ma, T ;
Campbell, SA ;
Gladfelter, WL .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :1038-1040
[8]  
HOERMAN B, ISIF 98, pC102
[9]   Gate oxide scaling limits and projection [J].
Hu, CM .
IEDM - INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 1996, 1996, :319-322
[10]   DETERMINING EFFECTIVE DIELECTRIC THICKNESSES OF METAL-OXIDE-SEMICONDUCTOR STRUCTURES IN ACCUMULATION-MODE [J].
HU, CY ;
KENCKE, DL ;
BANERJEE, S ;
BANDYOPADHYAY, B ;
IBOK, E ;
GARG, S .
APPLIED PHYSICS LETTERS, 1995, 66 (13) :1638-1640