LASER-ENHANCED PLASMA-ETCHING OF SILICON

被引:22
作者
HOLBER, W
REKSTEN, G
OSGOOD, RM
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D O I
10.1063/1.95684
中图分类号
O59 [应用物理学];
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页码:201 / 203
页数:3
相关论文
共 15 条
[1]   LASER-ENHANCED GAS-SURFACE CHEMISTRY - BASIC PROCESSES AND APPLICATIONS [J].
CHUANG, TJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 21 (03) :798-806
[2]   INFRARED-LASER RADIATION EFFECTS ON XEF2 INTERACTION WITH SILICON [J].
CHUANG, TJ .
JOURNAL OF CHEMICAL PHYSICS, 1981, 74 (02) :1461-1466
[3]   INFRARED-LASER INDUCED REACTIONS AT METAL AND SEMICONDUCTOR SURFACES [J].
CHUANG, TJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 18 (02) :638-642
[4]   PLASMA-ETCHING - DISCUSSION OF MECHANISMS [J].
COBURN, JW ;
WINTERS, HF .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1979, 16 (02) :391-403
[5]   LASER MICROPHOTOCHEMISTRY FOR USE IN SOLID-STATE ELECTRONICS [J].
EHRLICH, DJ ;
OSGOOD, RM ;
DEUTSCH, TF .
IEEE JOURNAL OF QUANTUM ELECTRONICS, 1980, 16 (11) :1233-1243
[6]   LASER CHEMICAL TECHNIQUE FOR RAPID DIRECT WRITING OF SURFACE RELIEF IN SILICON [J].
EHRLICH, DJ ;
OSGOOD, RM ;
DEUTSCH, TF .
APPLIED PHYSICS LETTERS, 1981, 38 (12) :1018-1020
[7]  
EHRLICH DJ, 1983, J VAC SCI TECHNOL B, V1, P969, DOI 10.1116/1.582718
[8]   BASIC CHEMISTRY AND MECHANISMS OF PLASMA-ETCHING [J].
FLAMM, DL ;
DONNELLY, VM ;
IBBOTSON, DE .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1983, 1 (01) :23-30
[9]   NON-THERMAL EFFECTS IN LASER-ENHANCED ETCHING OF SILICON BY XEF2 [J].
HOULE, FA .
CHEMICAL PHYSICS LETTERS, 1983, 95 (01) :5-8