MEASUREMENT OF FRACTURE-STRESS, YOUNG MODULUS, AND INTRINSIC STRESS OF HEAVILY BORON-DOPED SILICON MICROSTRUCTURES

被引：38

作者：

NAJAFI, K

SUZUKI, K

机构：

来源：

THIN SOLID FILMS | 1989年 / 181卷

关键词：

D O I：

10.1016/0040-6090(89)90492-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：251 / 258

页数：8

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