学术探索
学术期刊
新闻热点
数据分析
智能评审
立即登录
MODIFICATION OF SCHOTTKY BARRIERS IN SILICON BY REACTIVE ION ETCHING WITH NF3
被引:77
作者
:
ASHOK, S
论文数:
0
引用数:
0
h-index:
0
机构:
GE, CORP RES & DEV, SCHENECTADY, NY 12345 USA
GE, CORP RES & DEV, SCHENECTADY, NY 12345 USA
ASHOK, S
[
1
]
CHOW, TP
论文数:
0
引用数:
0
h-index:
0
机构:
GE, CORP RES & DEV, SCHENECTADY, NY 12345 USA
GE, CORP RES & DEV, SCHENECTADY, NY 12345 USA
CHOW, TP
[
1
]
BALIGA, BJ
论文数:
0
引用数:
0
h-index:
0
机构:
GE, CORP RES & DEV, SCHENECTADY, NY 12345 USA
GE, CORP RES & DEV, SCHENECTADY, NY 12345 USA
BALIGA, BJ
[
1
]
机构
:
[1]
GE, CORP RES & DEV, SCHENECTADY, NY 12345 USA
来源
:
APPLIED PHYSICS LETTERS
|
1983年
/ 42卷
/ 08期
关键词
:
D O I
:
10.1063/1.94073
中图分类号
:
O59 [应用物理学];
学科分类号
:
摘要
:
引用
收藏
页码:687 / 689
页数:3
相关论文
共 17 条
[11]
EDGE-DEFINED PATTERNING OF HYPERFINE REFRACTORY-METAL SILICIDE MOS STRUCTURES
OKAZAKI, S
论文数:
0
引用数:
0
h-index:
0
机构:
GE,CORP RES & DEV,SCHENECTADY,NY 12301
GE,CORP RES & DEV,SCHENECTADY,NY 12301
OKAZAKI, S
CHOW, TP
论文数:
0
引用数:
0
h-index:
0
机构:
GE,CORP RES & DEV,SCHENECTADY,NY 12301
GE,CORP RES & DEV,SCHENECTADY,NY 12301
CHOW, TP
STECKL, AJ
论文数:
0
引用数:
0
h-index:
0
机构:
GE,CORP RES & DEV,SCHENECTADY,NY 12301
GE,CORP RES & DEV,SCHENECTADY,NY 12301
STECKL, AJ
[J].
IEEE TRANSACTIONS ON ELECTRON DEVICES,
1981,
28
(11)
: 1364
-
1368
[12]
RANSOM C, COMMUNICATION
[13]
ELECTRICAL DAMAGE IN MOS DEVICES BY RF DIODE SPUTTERED ALUMINUM METALLIZATION
SERIKAWA, T
论文数:
0
引用数:
0
h-index:
0
SERIKAWA, T
YACHI, T
论文数:
0
引用数:
0
h-index:
0
YACHI, T
[J].
IEEE TRANSACTIONS ON ELECTRON DEVICES,
1981,
28
(07)
: 882
-
885
[14]
CONTROL OF SCHOTTKY-BARRIER HEIGHT USING HIGHLY DOPED SURFACE-LAYERS
SHANNON, JM
论文数:
0
引用数:
0
h-index:
0
机构:
MULLARD RES LABS,REDHILL,SURREY,ENGLAND
MULLARD RES LABS,REDHILL,SURREY,ENGLAND
SHANNON, JM
[J].
SOLID-STATE ELECTRONICS,
1976,
19
(06)
: 537
-
543
[15]
SINGH R, UNPUB J VAC SCI TECH
[16]
SCHOTTKY-BARRIER ELEVATION BY ION-IMPLANTATION AND IMPLANT SEGREGATION
THORNTON, RL
论文数:
0
引用数:
0
h-index:
0
THORNTON, RL
[J].
ELECTRONICS LETTERS,
1981,
17
(14)
: 485
-
486
[17]
RECENT DEVELOPMENTS IN DRY PROCESSING FOR VERY-LARGE-SCALE INTEGRATION
YASUDA, Y
论文数:
0
引用数:
0
h-index:
0
YASUDA, Y
[J].
THIN SOLID FILMS,
1982,
90
(03)
: 259
-
270
←
1
2
→
共 17 条
[11]
EDGE-DEFINED PATTERNING OF HYPERFINE REFRACTORY-METAL SILICIDE MOS STRUCTURES
OKAZAKI, S
论文数:
0
引用数:
0
h-index:
0
机构:
GE,CORP RES & DEV,SCHENECTADY,NY 12301
GE,CORP RES & DEV,SCHENECTADY,NY 12301
OKAZAKI, S
CHOW, TP
论文数:
0
引用数:
0
h-index:
0
机构:
GE,CORP RES & DEV,SCHENECTADY,NY 12301
GE,CORP RES & DEV,SCHENECTADY,NY 12301
CHOW, TP
STECKL, AJ
论文数:
0
引用数:
0
h-index:
0
机构:
GE,CORP RES & DEV,SCHENECTADY,NY 12301
GE,CORP RES & DEV,SCHENECTADY,NY 12301
STECKL, AJ
[J].
IEEE TRANSACTIONS ON ELECTRON DEVICES,
1981,
28
(11)
: 1364
-
1368
[12]
RANSOM C, COMMUNICATION
[13]
ELECTRICAL DAMAGE IN MOS DEVICES BY RF DIODE SPUTTERED ALUMINUM METALLIZATION
SERIKAWA, T
论文数:
0
引用数:
0
h-index:
0
SERIKAWA, T
YACHI, T
论文数:
0
引用数:
0
h-index:
0
YACHI, T
[J].
IEEE TRANSACTIONS ON ELECTRON DEVICES,
1981,
28
(07)
: 882
-
885
[14]
CONTROL OF SCHOTTKY-BARRIER HEIGHT USING HIGHLY DOPED SURFACE-LAYERS
SHANNON, JM
论文数:
0
引用数:
0
h-index:
0
机构:
MULLARD RES LABS,REDHILL,SURREY,ENGLAND
MULLARD RES LABS,REDHILL,SURREY,ENGLAND
SHANNON, JM
[J].
SOLID-STATE ELECTRONICS,
1976,
19
(06)
: 537
-
543
[15]
SINGH R, UNPUB J VAC SCI TECH
[16]
SCHOTTKY-BARRIER ELEVATION BY ION-IMPLANTATION AND IMPLANT SEGREGATION
THORNTON, RL
论文数:
0
引用数:
0
h-index:
0
THORNTON, RL
[J].
ELECTRONICS LETTERS,
1981,
17
(14)
: 485
-
486
[17]
RECENT DEVELOPMENTS IN DRY PROCESSING FOR VERY-LARGE-SCALE INTEGRATION
YASUDA, Y
论文数:
0
引用数:
0
h-index:
0
YASUDA, Y
[J].
THIN SOLID FILMS,
1982,
90
(03)
: 259
-
270
←
1
2
→