INTERFACIAL REACTIONS IN BIMETALLIC AG-SN THIN-FILM COUPLES

被引：32

作者：

SEN, SK ^{[1
]}

GHORAI, A ^{[1
]}

BANDYOPADHYAY, AK ^{[1
]}

SEN, S ^{[1
]}

机构：

[1] CENT GLASS & CERAM RES INST,CALCUTTA 700032,W BENGAL,INDIA

来源：

THIN SOLID FILMS | 1987年 / 155卷 / 02期

关键词：

ELECTRIC CONDUCTIVITY - INTERMETALLICS - MICROSCOPIC EXAMINATION - TIN AND ALLOYS - X-RAYS - Diffraction;

D O I：

10.1016/0040-6090(87)90069-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Interfacial reactions in bimetallic Ag-Sn thin film couples have been investigated by measurement of electrical resistance and contact resistance as a function of time and temperature in order to understand kinetic behavior in the above system where the intermetallic phase gamma -Ag//3Sn is formed. Since the reaction is found to start at room temperature, the conventional vacuum coating unit has been modified for preparing such films and conducting subsequent measurements without breaking the vacuum. The results from the above different methods of resistance measurement indicate that interfacial reactions are characterized by a mean diffusion coefficient of 10** minus **1**3cm**2s** minus **1 at room temperature. X-ray diffraction indicates growth of the gamma -AG//3Sn phase immediately after deposition. Scanning electron microscopy confirms the diffusion of tin into silver by grain boundary diffusion rather than by bulk diffusion. The results from transmission electron microscopy confirm the presence of a gamma -Ag//3Sn phase.

引用

页码：243 / 253

页数：11

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