METALLURGICAL TOPICS IN SILICON DEVICE INTERCONNECTIONS - THIN-FILM STRESSES

被引：75

作者：

DHEURLE, FM ^{[1
]}

机构：

[1] KUNGLIGA TEKN HOGSKOLAN, INST MIKROVAGSTEKN, STOCKHOLM, SWEDEN

来源：

关键词：

D O I：

10.1179/imr.1989.34.1.53

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：53 / 68

页数：16

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