TAPER ETCHING OF THE THERMAL OXIDE LAYER

被引：3

作者：

CHOI, YI

KIM, CK

KWON, YS

机构：

[1] AJOU UNIV,SEMICOND RES LAB,SEOUL 17000,SOUTH KOREA

[2] KOREA ADV INST SCI & TECHNOL,DEPT ELECT ENGN,SEOUL 131,SOUTH KOREA

来源：

IEE PROCEEDINGS-I COMMUNICATIONS SPEECH AND VISION | 1986年 / 133卷 / 01期

关键词：

D O I：

10.1049/ip-i-1.1986.0003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：13 / 17

页数：5

共 11 条

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[10] FAILURE ANALYSIS OF EVAPORATED METAL INTERCONNECTIONS AT CONTACT WINDOWS [J].

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