CAVERNOUS UNDERCUTS APPEARING IN REACTIVE ION ETCHED SUBMICRON-WIDE DEEP TRENCHES

被引：28

作者：

OHKI, S

ODA, M

AKIYA, H

SHIBATA, T

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1987年 / 5卷 / 06期

关键词：

D O I：

10.1116/1.583637

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1611 / 1616

页数：6

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