REACTIVE MAGNETRON SPUTTERING OF TIN - ANALYSIS OF THE DEPOSITION PROCESS

被引：18

作者：

DANROC, J

AUBERT, A

GILLET, R

机构：

来源：

SURFACE & COATINGS TECHNOLOGY | 1987年 / 33卷 / 1-4期

关键词：

D O I：

10.1016/0257-8972(87)90179-4

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

收藏

页码：83 / 90

页数：8

相关论文

共 6 条

[1] MASS-FLOW LIMITATIONS IN REACTIVE SPUTTERING
BLOM, HO
BERG, S
LARSSON, T
[J]. THIN SOLID FILMS, 1985, 130 (3-4) : 307 - 313
[2] THE ANALYSIS AND AUTOMATIC-CONTROL OF A REACTIVE DC MAGNETRON SPUTTERING PROCESS
ENJOUJI, K
MURATA, K
NISHIKAWA, S
[J]. THIN SOLID FILMS, 1983, 108 (01) : 1 - 7
[3] REACTIVE SPUTTERING CHARACTERISTICS OF SILICON IN AN AR-N2 MIXTURE
OKAMOTO, A
SERIKAWA, T
[J]. THIN SOLID FILMS, 1986, 137 (01) : 143 - 151
[4] MECHANISMS OF THE BIASED SPUTTERING OF TITANIUM IN AN AR-N2 MIXTURE
POITEVIN, JM
LEMPERIERE, G
[J]. THIN SOLID FILMS, 1984, 120 (03) : 223 - 230
[5] DEPOSITION OF HARD WEAR-RESISTANT COATINGS BY REACTIVE DC PLASMATRON SPUTTERING
SCHILLER, S
HEISIG, U
BEISTER, G
STEINFELDER, K
STRUMPFEL, J
KORNDORFER, C
SIEBER, W
[J]. THIN SOLID FILMS, 1984, 118 (03) : 255 - 270
[6] EFFECT OF N-2-AR MIXING ON THE REACTIVE SPUTTERING CHARACTERISTICS OF SILICON
SERIKAWA, T
OKAMOTO, A
[J]. THIN SOLID FILMS, 1983, 101 (01) : 1 - 6