A significant reduction in lasing threshold is achieved by rapid thermal annealing (RTA) for strained InGaAs/GaAs single quantum well lasers grown by molecular beam epitaxy under standard conditions (the growth temperature is 620-degrees-C or less), not especially optimized for lasers. When RTA at 900-degrees-C for 10 s is applied twice to the wafer after the growth, the room-temperature photoluminescence efficiency of the active layer increases by about 80 times and the threshold current decreases by a factor of 5 to 7. We suggest that this enhancement is due to improvement of the quality of the InGaAs quantum well rather than that of the AlGaAs cladding layers.