EFFECT OF CHEMICAL BONDING ON POSITIVE SECONDARY-ION YIELDS IN SPUTTERING

被引:16
作者
MANN, K
YU, ML
机构
来源
PHYSICAL REVIEW B | 1987年 / 35卷 / 12期
关键词
D O I
10.1103/PhysRevB.35.6043
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:6043 / 6050
页数:8
相关论文
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