A NEW MODEL FOR THE THERMAL-OXIDATION KINETICS OF SILICON

被引:36
作者
NICOLLIAN, EH [1 ]
REISMAN, A [1 ]
机构
[1] MICROELECTR CTR N CAROLINA, RES TRIANGLE PK, NC 27709 USA
关键词
D O I
10.1007/BF02652105
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:263 / 272
页数:10
相关论文
共 32 条
[11]   PARALLEL OXIDATION MECHANISM FOR SI OXIDATION IN DRY O2 [J].
HAN, CJ ;
HELMS, CR .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (05) :1297-1302
[12]   SILICON OXIDATION STUDIES - A REVISED MODEL FOR THERMAL-OXIDATION [J].
IRENE, EA .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (09) :5416-5420
[13]   EFFECT OF AN ELECTRIC FIELD ON SILICON OXIDATION [J].
JORGENSEN .
JOURNAL OF CHEMICAL PHYSICS, 1962, 37 (04) :874-&
[14]   THE MECHANISMS FOR SILICON OXIDATION IN STEAM AND OXYGEN [J].
LIGENZA, JR ;
SPITZER, WG .
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1960, 14 :131-136
[15]   OXIDATION OF SILICON BY HIGH-PRESSURE STEAM [J].
LIGENZA, JR .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1962, 109 (02) :73-76
[16]   THERMAL-OXIDATION OF SILICON IN DRY OXYGEN - ACCURATE DETERMINATION OF THE KINETIC RATE CONSTANTS [J].
MASSOUD, HZ ;
PLUMMER, JD ;
IRENE, EA .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (07) :1745-1753
[17]  
MASSOUD HZ, 1983, G5021 STANF U TECH R
[18]   SI-]SIO2 TRANSFORMATION - INTERFACIAL STRUCTURE AND MECHANISM [J].
OURMAZD, A ;
TAYLOR, DW ;
RENTSCHLER, JA ;
BEVK, J .
PHYSICAL REVIEW LETTERS, 1987, 59 (02) :213-216
[19]   EVIDENCE FOR OXIDATION GROWTH AT THE OXIDE-SILICON INTERFACE FROM CONTROLLED ETCH STUDIES [J].
PLISKIN, WA ;
GNALL, RP .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1964, 111 (07) :872-873
[20]   ETCHING AND POLISHING BEHAVIOR OF GE AND SI WITH HI [J].
REISMAN, A ;
BERKENBLIT, M .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1965, 112 (08) :812-+