RESIDUAL-STRESS AND MECHANICAL-PROPERTIES OF BORON-DOPED P+-SILICON FILMS

被引：38

作者：

DING, XY ^{[1
]}

KO, WH ^{[1
]}

MANSOUR, JM ^{[1
]}

机构：

[1] CASE WESTERN RESERVE UNIV,DEPT MECH & AEROSP ENGN,CLEVELAND,OH 44106

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1990年 / 23卷 / 1-3期

基金：

美国国家科学基金会;

关键词：

10;

D O I：

10.1016/0924-4247(90)87048-N

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：866 / 871

页数：6

共 10 条

[1] MICROFABRICATED STRUCTURES FOR THE INSITU MEASUREMENT OF RESIDUAL-STRESS, YOUNGS MODULUS, AND ULTIMATE STRAIN OF THIN-FILMS
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MEHREGANY, M
HOWE, RT
SENTURIA, SD
[J]. APPLIED PHYSICS LETTERS, 1987, 51 (04) : 241 - 243
[2] A TECHNIQUE FOR THE DETERMINATION OF STRESS IN THIN-FILMS
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RANDALL, JN
FLANDERS, DC
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1983, 1 (04): : 1364 - 1366
[3] BYARS EF, 1969, ENG MECHANICS DEFORM, P232
[4] PRESSURE SENSITIVITY IN ANISOTROPICALLY ETCHED THIN-DIAPHRAGM PRESSURE SENSORS
CLARK, SK
WISE, KD
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1979, 26 (12) : 1887 - 1896
[5] A SIMPLE TECHNIQUE FOR THE DETERMINATION OF MECHANICAL STRAIN IN THIN-FILMS WITH APPLICATIONS TO POLYSILICON
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RANDAZZO, T
BURNS, DW
[J]. JOURNAL OF APPLIED PHYSICS, 1985, 57 (05) : 1671 - 1675
[6] THE STRUCTURE MECHANICAL PROPERTY RELATIONSHIP OF AMORPHOUS-SILICON MONOXIDE THIN-FILMS
HOFFMAN, RW
MITCHELL, TE
HOFFMAN, RW
[J]. THIN SOLID FILMS, 1987, 154 (1-2) : 149 - 157
[7] VIBRATION ANALYSIS OF MICROMECHANICAL ELEMENTS
HOK, B
GUSTAFSSON, K
[J]. SENSORS AND ACTUATORS, 1985, 8 (03): : 235 - 243
[8] STRESS IN POLYCRYSTALLINE AND AMORPHOUS-SILICON THIN-FILMS
HOWE, RT
MULLER, RS
[J]. JOURNAL OF APPLIED PHYSICS, 1983, 54 (08) : 4674 - 4675
[9] YOUNGS MODULUS MEASUREMENTS OF THIN-FILMS USING MICROMECHANICS
PETERSEN, KE
GUARNIERI, CR
[J]. JOURNAL OF APPLIED PHYSICS, 1979, 50 (11) : 6761 - 6766
[10] SILICON AS A MECHANICAL MATERIAL
PETERSEN, KE
[J]. PROCEEDINGS OF THE IEEE, 1982, 70 (05) : 420 - 457

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