ORIENTED GROWTH OF CU(110) ON YSI2-X(1(1)OVER-BAR-00/SI(100) AND DIFFUSION BEHAVIOR IN COPPER SILICIDE FORMATION

被引:7
作者
NOMURA, K
NOYA, A
SASAKI, K
SUNAGA, K
机构
[1] Department of Electrical and Electronic Engineering, Kitami Institute of Technology, Kitami
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS | 1994年 / 33卷 / 6B期
关键词
CU(110) FILM; YTTRIUM SILICIDE; COPPER SILICIDE; EPITAXIAL GROWTH; CU METALLIZATION;
D O I
10.1143/JJAP.33.L880
中图分类号
O59 [应用物理学];
学科分类号
摘要
The growth and diffusion characterization of Cu films on the YSi2-x(1100BAR)/Si(100) substrate are studied. On the YSi2-x(1100BAR) layer prepared using a thin template layer, highly oriented Cu(110) film growth is observed, and Cu diffusion through the YSi2-x layer and the subsequent Cu3Si formation occur at temperatures as low as 200-degrees-C. On the contrary, the growth of Cu with normal orientation is evident on the YSi2-x layer with poor epitaxial quality, and the out-diffusion of Si forms a CU3Si layer on the YSi2-x layer. The film growth on YSi2-x layers is discussed on the basis of the lattice match between superlattice cells of Cu and YSi2-x, and the diffusion behavior is interpreted in terms of relaxation of the affinity of Cu for Si.
引用
收藏
页码:L880 / L883
页数:4
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