SILICON ETCHING IN A DIRECT-CURRENT GLOW-DISCHARGE OF CF4/O2 AND NF3/O2

被引:4
作者
BLOM, HO
BERG, S
NENDER, C
NORSTROM, H
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1989年 / 7卷 / 06期
关键词
D O I
10.1116/1.584532
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:1321 / 1324
页数:4
相关论文
共 12 条
[1]   DC-ETCHING OF POLYSILICON WITH FLUORINE CHEMISTRY [J].
BLOM, HO ;
NENDER, C ;
BERG, S ;
NORSTROM, H .
VACUUM, 1988, 38 (8-10) :813-816
[2]  
CHAPMAN B, 1980, GLOW DISCHARGE PROCE, P147
[3]   OPTICAL-EMISSION SPECTROSCOPY OF REACTIVE PLASMAS - A METHOD FOR CORRELATING EMISSION INTENSITIES TO REACTIVE PARTICLE DENSITY [J].
COBURN, JW ;
CHEN, M .
JOURNAL OF APPLIED PHYSICS, 1980, 51 (06) :3134-3136
[4]   PLASMA-ETCHING OF SI AND SIO2 IN SF6-O2 MIXTURES [J].
DAGOSTINO, R ;
FLAMM, DL .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (01) :162-167
[5]  
Holland L., 1974, VACUUM MANUAL, V1st ed., P1
[6]   A STUDY OF SI PLASMA-ETCHING IN CF4+O2 GAS WITH A PLANAR-TYPE REACTOR [J].
KAWATA, H ;
SHIBANO, T ;
MURATA, K ;
NAGAMI, K .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (05) :2720-2726
[7]   A KINETIC-STUDY OF THE PLASMA-ETCHING PROCESS .1. A MODEL FOR THE ETCHING OF SI AND SIO2 IN CNFM/H2 AND CNFM/O2 PLASMAS [J].
KUSHNER, MJ .
JOURNAL OF APPLIED PHYSICS, 1982, 53 (04) :2923-2938
[8]   A KINETIC-STUDY OF THE PLASMA-ETCHING PROCESS .2. PROBE MEASUREMENTS OF ELECTRON PROPERTIES IN AN RF PLASMA-ETCHING REACTOR [J].
KUSHNER, MJ .
JOURNAL OF APPLIED PHYSICS, 1982, 53 (04) :2939-2946
[9]   PLASMA ETCHING OF SI AND SIO2 - EFFECT OF OXYGEN ADDITIONS TO CF4 PLASMAS [J].
MOGAB, CJ ;
ADAMS, AC ;
FLAMM, DL .
JOURNAL OF APPLIED PHYSICS, 1978, 49 (07) :3796-3803
[10]   THE EFFECT OF OXYGEN ON THE ETCH RATE OF NF3 DISCHARGES [J].
NORDHEDEN, KJ ;
VERDEYEN, JT .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (10) :2168-2171