SCANNING MICROSPOT AUGER-SPECTROSCOPY STUDY OF INTERDIFFUSION AND EUTECTIC FORMATION IN W-PT-W-AU THIN-FILMS

被引：5

作者：

CHRISTOU, A ^{[1
]}

DAY, HM ^{[1
]}

机构：

[1] USN,RES LAB,WASHINGTON,DC 20375

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1975年 / 11卷 / 03期

关键词：

D O I：

10.1109/TPHP.1975.1135060

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：229 / 235

页数：7

相关论文

共 21 条

[1] BOTTOMS WR, 1972, SCANNING ELECTRON MI, P182
[2] BRANDIS EK, 1971, SEM 1971 1, P505
[3] CHANG CC, 1971, SURF SCI, V25, P52
[4] STRUCTURE AND THERMAL-STABILITY OF SPUTTERED AU-TA FILMS
CHRISTOU, A
DAY, H
[J]. JOURNAL OF APPLIED PHYSICS, 1973, 44 (08) : 3386 - 3393
[5] STABILIZED TANTALUM DIFFUSION BARRIER FOR GOLD METALLIZATION SYSTEM
CHRISTOU, A
DAY, HM
[J]. JOURNAL OF ELECTRONIC MATERIALS, 1974, 3 (01) : 25 - 35
[6] RELIABILITY OF GOLD-STABILIZED TANTALUM METALLIZATIONS FOR MICROWAVE-POWER TRANSISTORS
CHRISTOU, A
DAY, HM
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1974, 121 (08) : 1076 - 1081
[7] SEM, AUGER-SPECTROSCOPY AND ION BACKSCATTERING TECHNIQUES APPLIED TO ANALYSES OF AU-REFRACTORY METALLIZATIONS
CHRISTOU, A
JARVIS, L
WEISENBERGER, WH
HIRVONEN, JK
[J]. JOURNAL OF ELECTRONIC MATERIALS, 1975, 4 (02) : 329 - 345
[8] CHRISTOU A, 1975, 1975 SEMIITRI S ST L
[9] CHRISTOU A, 1974, J APPL PHYS, V44, P5259
[10] CORROSION RESISTANCE OF SEVERAL INTEGRATED-CIRCUIT METALLIZATION SYSTEMS
CUNNINGHAM, JA
FULLER, CR
HAYWOOD, CT
[J]. IEEE TRANSACTIONS ON RELIABILITY, 1970, R 19 (04) : 182 - +