ION-IMPLANTATION OF ARSENIC IN CHEMICAL VAPOR-DEPOSITION TUNGSTEN SILICIDE

被引:4
作者
HARA, T
TAKAHASHI, H
CHEN, SC
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1985年 / 3卷 / 06期
关键词
D O I
10.1116/1.582958
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:1664 / 1667
页数:4
相关论文
共 10 条
[1]   REFRACTORY-METAL SILICIDES - THIN-FILM PROPERTIES AND PROCESSING TECHNOLOGY [J].
CHOW, TP ;
STECKL, AJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (11) :1480-1497
[2]  
DHEURLE FM, 1980, J APPL PHYS, V51, P5976, DOI 10.1063/1.327517
[3]  
ENOMOTO S, 1983, 2ND S ION BEAM TECHN
[4]   ARSENIC IMPLANTATION IN CVD TUNGSTEN SILICIDE [J].
HARA, T ;
TAKAHASHI, H ;
CHEN, SC .
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1985, 88 (02) :K131-K136
[5]   INTERFACIAL REACTION IN POLYCIDE MOS GATE STRUCTURE EMPLOYING CVD TUNGSTEN SILICIDE [J].
HARA, T ;
ENOMOTO, S ;
JINBO, T .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1984, 23 (07) :L455-L457
[6]  
HARA T, UNPUB JPN J APPL PHY
[7]   A NEW TUNGSTEN GATE PROCESS FOR VLSI APPLICATIONS [J].
IWATA, S ;
YAMAMOTO, N ;
KOBAYASHI, N ;
TERADA, T ;
MIZUTANI, T .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1984, 31 (09) :1174-1179
[8]   THE BEHAVIOR OF BORON (ALSO ARSENIC) IN BILAYERS OF POLYCRYSTALLINE SILICON AND TUNGSTEN DISILICIDE [J].
JAHNEL, F ;
BIERSACK, J ;
CROWDER, BL ;
DHEURLE, FM ;
FINK, D ;
ISAAC, RD ;
LUCCHESE, CJ ;
PETERSSON, CS .
JOURNAL OF APPLIED PHYSICS, 1982, 53 (11) :7372-7378
[9]   DOPANT DIFFUSION IN TUNGSTEN SILICIDE [J].
PAN, P ;
HSIEH, N ;
GEIPEL, HJ ;
SLUSSER, GJ .
JOURNAL OF APPLIED PHYSICS, 1982, 53 (04) :3059-3062
[10]  
TSAI MY, 1980, APPL PHYS LETT, V37, P5350