EFFECT OF ANNEALING ON THE SCHOTTKY-BARRIER HEIGHT OF AL/N-SI SCHOTTKY DIODES AFTER AR+ ION-BOMBARDMENT

被引:11
作者
CARR, BA
FRIEDLAND, E
MALHERBE, JB
机构
关键词
D O I
10.1063/1.341197
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:4775 / 4777
页数:3
相关论文
共 13 条
[1]   EFFECT OF AR+ ION-BOMBARDMENT ON THE ELECTRICAL CHARACTERISTICS OF AL/N-SI CONTACTS [J].
CARR, BA ;
FRIEDLAND, E ;
MALHERBE, JB .
JOURNAL OF APPLIED PHYSICS, 1987, 61 (07) :2566-2570
[2]  
CARR BA, 1987, THESIS U PRETORIA
[3]   AL-SI CONTACTS FORMED BY ION IRRADIATION AND POST-ANNEALING [J].
HUNG, LS ;
MAYER, JW ;
ZHANG, M ;
WOLF, ED .
APPLIED PHYSICS LETTERS, 1983, 43 (12) :1123-1125
[4]   AL-RECOIL IMPLANTATION INTO N-TYPE SI USING DIFFERENT PRIMARY IONS [J].
KWOK, HL ;
WONG, WC ;
WONG, SC .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 1988, 3 (01) :6-11
[5]  
MALHERBE JB, IN PRESS NUCL INST B
[6]   EFFECTS OF ION MIXING ON AL-SI CONTACTS [J].
PAI, CS ;
SCOTT, DM ;
LAU, SS ;
SUNI, I ;
ERANEN, S .
THIN SOLID FILMS, 1985, 126 (3-4) :241-249
[7]   ELECTRICAL EFFECT ON SCHOTTKY-BARRIER DIODES OF SI CRYSTALLIZATION FROM AL-SI METAL-FILMS [J].
REITH, TM ;
SCHICK, JD .
APPLIED PHYSICS LETTERS, 1974, 25 (09) :524-526
[8]  
ROSENBERG R, 1978, THIN FILMS INTERDIFF
[9]   RECOIL IMPLANTATION OF ALUMINUM INTO NORMAL-SILICON [J].
WONG, WC ;
LAM, YW ;
KWOK, HL .
JOURNAL OF MATERIALS SCIENCE LETTERS, 1987, 6 (05) :531-534
[10]   TRANSITION FROM SCHOTTKY BARRIERS TO P-N-JUNCTIONS [J].
WONG, WC ;
KWOK, HL .
SOLID-STATE ELECTRONICS, 1987, 30 (07) :719-722