Annealing behavior of a Light Scattering Tomography detected Defect near the surface of Si wafers

被引:6
作者
Furukawa, J
Iwaoka, N
Furuya, H
机构
来源
ICDS-18 - PROCEEDINGS OF THE 18TH INTERNATIONAL CONFERENCE ON DEFECTS IN SEMICONDUCTORS, PTS 1-4 | 1995年 / 196-卷
关键词
Czochralski silicon; grown-in defects; Light Scattering Tomography detecting Defect;
D O I
10.4028/www.scientific.net/MSF.196-201.1725
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The behavior of Light Scattering Tomography detected Defects (LSTD) after annealing located in 0 to about 20 mu m beneath the surface of Si wafers is investigated. LSTDs are detected by the obliquely incident method of infrared light scattering tomography (IR-LST) before and after annealing at temperatures from 1000 degrees C to 1280 degrees C in dry O-2, Ne, Or He. LSTDs remained after annealing at temperatures below 1250 degrees C in dry O2 or Na for 4 hours and disappear after annealing at 1280 degrees C. However, after annealing at 1180 degrees C for 2 hours in H2 ambient, LSTDs located in the region 0 to about 6 mu m beneath the surface of Si wafers disappear, while LSTDs located in the region deeper than about 6 mu m beneath the surface remain.
引用
收藏
页码:1725 / 1729
页数:5
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