STRESSES IN SPUTTERED TUNGSTEN THIN-FILMS

被引：29

作者：

HAGHIRIGOSNET, AM

LADAN, FR

MAYEUX, C

LAUNOIS, H

机构：

来源：

关键词：

D O I：

10.1016/0169-4332(89)90550-3

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

引用

页码：295 / 303

页数：9

共 18 条

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[2] GRAIN-GROWTH AND STRESS RELIEF IN THIN-FILMS
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[3] ORIGINS OF STRESS IN THIN NICKEL FILMS
DOLJACK, FA
HOFFMAN, RW
[J]. THIN SOLID FILMS, 1972, 12 (01) : 71 - &
[4] Gosnet A. M., 1987, Microelectronic Engineering, V6, P253, DOI 10.1016/0167-9317(87)90046-3
[5] HAGHIRIGOSNET AM, IN PRESS J VACUUM SC
[6] RESIDUAL-STRESS IN NICKEL FILMS EVAPORATED AT OBLIQUE-INCIDENCE
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[J]. JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, 1977, 43 (06) : 1991 - 1997
[7] HEURLE FMD, 1970, METALL T, V1, P725
[8] INTERNAL-STRESSES IN SPUTTERED CHROMIUM
HOFFMAN, DW
THORNTON, JA
[J]. THIN SOLID FILMS, 1977, 40 (JAN) : 355 - 363
[9] INTERNAL-STRESSES IN CR, MO, TA, AND PT FILMS DEPOSITED BY SPUTTERING FROM A PLANAR MAGNETRON SOURCE
HOFFMAN, DW
THORNTON, JA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 20 (03): : 355 - 358
[10] HOFFMAN DW, 1983, 9TH P INT VAC C 5TH, P415