ELECTROMIGRATION IN FINE-LINE SPUTTER-GUN AL

被引:43
作者
VAIDYA, S
FRASER, DB
LINDENBERGER, WS
机构
关键词
D O I
10.1063/1.328269
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:4475 / 4482
页数:8
相关论文
共 12 条
[1]   DEPENDENCE OF ELECTROMIGRATION-INDUCED FAILURE TIME ON LENGTH AND WIDTH OF ALUMINUM THIN-FILM CONDUCTORS [J].
AGARWALA, BN ;
ATTARDO, MJ ;
INGRAHAM, AP .
JOURNAL OF APPLIED PHYSICS, 1970, 41 (10) :3954-&
[2]   APPLICATIONS OF THIN-FILMS IN MICROELECTRONICS [J].
ANDERSON, JC .
THIN SOLID FILMS, 1972, 12 (01) :1-&
[3]   ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J].
ATTARDO, MJ ;
ROSENBERG, R .
JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) :2381-+
[4]  
BLACK J, 1977, RADCTR77410 MOT SEM
[5]  
BLACK JR, 1978, P IEEE REL PHYS S, P233
[6]   ELECTROMIGRATION AND CREVICE FORMATION IN THIN METALLIC FILMS [J].
BLECH, IA .
THIN SOLID FILMS, 1972, 13 (01) :117-&
[7]  
HOWARD JK, 1968, IBM TECH REP, V22, P601
[8]   ELECTROMIGRATION EFFECTS IN ALUMINUM-ALLOY METALLIZATION [J].
LEARN, AJ .
JOURNAL OF ELECTRONIC MATERIALS, 1974, 3 (02) :531-552
[9]  
NAGASAWA E, 1979, P IEEE REL PHYS S, V64
[10]  
SCHOEN JM, UNPUBLISHED