EFFECTS OF SUBSTRATE-TEMPERATURE ON COPPER DISTRIBUTION, RESISTIVITY, AND MICROSTRUCTURE IN MAGNETRON-SPUTTERED AL-CU FILMS

被引：11

作者：

AHN, KY ^{[1
]}

LIN, T ^{[1
]}

MADAKSON, PB ^{[1
]}

HOFFMAN, V ^{[1
]}

机构：

[1] VARIAN ASSOCIATES,PALO ALTO,CA 94303

来源：

THIN SOLID FILMS | 1987年 / 153卷

关键词：

ELECTRIC CONDUCTIVITY - METALLOGRAPHY - Microstructure - SPUTTERING;

D O I：

10.1016/0040-6090(87)90201-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The purpose of our study was to understand the effects of substrate temperature on the copper distribution, electrical resistivity and microstructure of Al-Cu films deposited in a commercial production system equipped with a high rate sputtering source (Al-4%Cu, by weight) and temperature controlling capability.

引用

收藏

页码：409 / 419

页数：11

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