THERMAL GROOVING, THERMOTRANSPORT AND ELECTROTRANSPORT IN DOPED AND UNDOPED THIN GOLD-FILMS

被引：48

作者：

HUMMEL, RE

DEHOFF, RT

MATTSGOHO, S

GOHO, WM

机构：

来源：

THIN SOLID FILMS | 1981年 / 78卷 / 01期

关键词：

D O I：

10.1016/0040-6090(81)90412-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：1 / 14

页数：14

共 19 条

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[7] ELECTROMIGRATION IN THIN GOLD FILMS [J].

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[8] DIRECTION OF ELECTROMIGRATION IN THIN SILVER, GOLD, AND COPPER FILMS [J].

HUMMEL, RE ;

BREITLING, RM .

APPLIED PHYSICS LETTERS, 1971, 18 (09) :373-+

[9] ACTIVATION-ENERGY FOR ELECTROTRANSPORT IN THIN SILVER AND GOLD-FILMS [J].

HUMMEL, RE ;

GEIER, HJ .

THIN SOLID FILMS, 1975, 25 (02) :335-342

[10] EFFECT OF MINOR CONSTITUENTS ON ELECTRO-TRANSPORT-INDUCED FAILURE SITE IN THIN GOLD-FILMS [J].

HUMMEL, RE ;

KRUMEICH, BK ;

DEHOFF, RT .

APPLIED PHYSICS LETTERS, 1978, 33 (11) :960-962

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