OXYGEN BEHAVIOR DURING TITANIUM SILICIDE FORMATION BY RAPID THERMAL ANNEALING

被引:30
作者
PANTEL, R [1 ]
LEVY, D [1 ]
NICOLAS, D [1 ]
PONPON, JP [1 ]
机构
[1] CTR RECH NUCL,PHASE GRP,CNRS,UA 292,F-67037 STRASBOURG,FRANCE
关键词
D O I
10.1063/1.339062
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:4319 / 4321
页数:3
相关论文
共 22 条
  • [1] DEVELOPMENT OF THE SELF-ALIGNED TITANIUM SILICIDE PROCESS FOR VLSI APPLICATIONS
    ALPERIN, ME
    HOLLAWAY, TC
    HAKEN, RA
    GOSMEYER, CD
    KARNAUGH, RV
    PARMANTIE, WD
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (02) : 141 - 149
  • [2] TRANSIENT ANNEALING AS A TOOL FOR THE INVESTIGATION OF THIN-FILM SUBSTRATE SOLID-PHASE REACTIONS
    BENTINI, GG
    NIPOTI, R
    BERTI, M
    DRIGO, AV
    COHEN, C
    [J]. JOURNAL OF APPLIED PHYSICS, 1985, 58 (03) : 1234 - 1239
  • [3] GROWTH AND STRUCTURE OF TITANIUM SILICIDE PHASES FORMED BY THIN TI FILMS ON SI CRYSTALS
    BENTINI, GG
    NIPOTI, R
    ARMIGLIATO, A
    BERTI, M
    DRIGO, AV
    COHEN, C
    [J]. JOURNAL OF APPLIED PHYSICS, 1985, 57 (02) : 270 - 275
  • [4] TITANIUM AND NICKEL SILICIDE FORMATION AFTER Q-SWITCHED LASER AND MULTI-SCANNING ELECTRON-BEAM IRRADIATION
    BENTINI, GG
    SERVIDORI, M
    COHEN, C
    NIPOTI, R
    DRIGO, AV
    [J]. JOURNAL OF APPLIED PHYSICS, 1982, 53 (03) : 1525 - 1531
  • [5] TITANIUM SILICIDE FORMATION - EFFECT OF OXYGEN DISTRIBUTION IN THE METAL-FILM
    BERTI, M
    DRIGO, AV
    COHEN, C
    SIEJKA, J
    BENTINI, GG
    NIPOTI, R
    GUERRI, S
    [J]. JOURNAL OF APPLIED PHYSICS, 1984, 55 (10) : 3558 - 3565
  • [6] THERMODYNAMIC CONSIDERATIONS IN REFRACTORY METAL-SILICON-OXYGEN SYSTEMS
    BEYERS, R
    [J]. JOURNAL OF APPLIED PHYSICS, 1984, 56 (01) : 147 - 152
  • [7] DAVID D, 1983, J ELECTROCHEM SOC, V130, P1423, DOI 10.1149/1.2119966
  • [8] DHEURLE FM, 1986, MATER RES SOC S P, V52, P261
  • [9] KINETICS OF TISI2 FORMATION BY THIN TI FILMS ON SI
    HUNG, LS
    GYULAI, J
    MAYER, JW
    LAU, SS
    NICOLET, MA
    [J]. JOURNAL OF APPLIED PHYSICS, 1983, 54 (09) : 5076 - 5080
  • [10] Lau C. K., 1982, International Electron Devices Meeting. Technical Digest, P714