PROPERTIES OF HARD TUNGSTEN FILMS PREPARED BY SPUTTERING

被引：17

作者：

SHIH, KK

SMITH, DA

CROWE, JR

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1988年 / 6卷 / 03期

关键词：

D O I：

10.1116/1.575307

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1681 / 1685

页数：5

共 22 条

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[6] GRAIN-STRUCTURE VARIATION WITH TEMPERATURE FOR EVAPORATED METAL-FILMS
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1984, 2 (02): : 218 - 219
[7] COMPRESSIVE STRESS TRANSITION IN AL, V, ZR, NB AND W METAL-FILMS SPUTTERED AT LOW WORKING PRESSURES
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[J]. THIN SOLID FILMS, 1977, 45 (02) : 387 - 396
[8] HARDNESS AND GRAIN-SIZE RELATIONS FOR THICK CHROMIUM FILMS DEPOSITED BY HOLLOW-CATHODE DISCHARGE
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[J]. THIN SOLID FILMS, 1977, 45 (03) : 473 - 479
[9] HIGH RESISTIVITY OF DC-SPUTTERED METAL FILMS
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[J]. JOURNAL OF APPLIED PHYSICS, 1971, 42 (11) : 4366 - &
[10] MOVCHAN BA, 1969, PHYS METALS METALLOG, V28, P83

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