ELECTROMIGRATION-INDUCED FAILURES IN THIN-FILM AL-CU CONDUCTORS

被引：15

作者：

AGARWALA, BN ^{[1
]}

BERENBAUM, L ^{[1
]}

PERESSININ, P ^{[1
]}

机构：

[1] IBM CORP, SYST PROD DIV, E FISHKILL FACIL, HOPEWELL JUNCTION, NY 12533 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1974年 / 3卷 / 01期

关键词：

D O I：

10.1007/BF02654549

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：137 / 153

页数：17

相关论文

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