High Performance 70-nm Germanium pMOSFETs With Boron LDD Implants

被引:37
作者
Hellings, Geert [1 ,2 ]
Mitard, Jerome [1 ,2 ]
Eneman, Geert [1 ,2 ,3 ]
De Jaeger, Brice [1 ]
Brunco, David P. [1 ]
Shamiryan, Denis [1 ]
Vandeweyer, Tom [1 ]
Meuris, Marc [1 ]
Heyns, Marc M. [1 ,4 ]
De Meyer, Kristin [1 ,2 ]
机构
[1] Interuniv Microelect Ctr, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, ESAT INSYS, B-3000 Louvain, Belgium
[3] Res Fdn Flanders FWO, B-1000 Brussels, Belgium
[4] Katholieke Univ Leuven, MTM, B-3000 Louvain, Belgium
关键词
Benchmarking; germanium; LDD; MOSFETs; GE PMOSFETS;
D O I
10.1109/LED.2008.2008824
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Ge pMOSFETs with gate lengths down to 70 nm are fabricated in a Si-like process flow. Reducing the LDD junction depth from 24 to 21 nm effectively reduces short-channel effects. In addition, a reduced source/drain series resistance is obtained using pure boron LDD implants over BF2, resulting in a significant I-ON boost. Benchmarking shows the potential of Ge to outperform (strained) Si, well into the sub-100-nm regime. The 70-nm devices outperform the ITRS requirements for I-ON by 50%, maintaining similar I-OFF, as measured at the source.
引用
收藏
页码:88 / 90
页数:3
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