Study of tantalum oxide thin film capacitors on metallized polymer sheets for advanced packaging applications

被引：23

作者：

Chen, K ^{[1
]}

Nielsen, M ^{[1
]}

Soss, S ^{[1
]}

Rymaszewski, EJ ^{[1
]}

Lu, TM ^{[1
]}

Wan, CT ^{[1
]}

机构：

[1] SHELDAHL INC, NORTHFIELD, MN 55057 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1997年 / 20卷 / 02期

关键词：

breakdown voltage; decoupling capacitors; electronic packaging; leakage current; polyimide sheets; substrate surface topography;

D O I：

10.1109/96.575561

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Tantalum oxide thin film capacitors were fabricated on metallized polyimide sheet substrates and tested. It was found that the substrates' surface topography has a strong influence on the electrical properties and yields of the thin film capacitors, The leakage current density and breakdown field strength of the capacitors are qualitatively correlated to the amount and degree of surface irregularities on the substrates, which were analyzed using scanning electron microscopy (SEM), atomic force microscopy (AFM), and profilometry, It was demonstrated that Benzocyclobutene (BCB) can be used to planarize the surface irregularities and to improve the capacitor yield and performance, The importance of choosing the right substrate materials for thin film capacitor fabrication is also discussed.

引用

页码：117 / 122

页数：6

共 8 条

[1] BENZOCYCLOBUTENE (BCB) DIELECTRICS FOR THE FABRICATION OF HIGH-DENSITY, THIN-FILM MULTICHIP MODULES [J].