Key issues in fabricating microstructures with high aspect ratios by using deep X-ray lithography

被引：9

作者：

Cheng, CM ^{[1
]}

Chen, RH ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Dept Mech Engn, Hsinchu 30010, Taiwan

来源：

MICROELECTRONIC ENGINEERING | 2004年 / 71卷 / 3-4期

关键词：

LIGA; DXRL; high aspect ratio; exposure and development; microstructure;

D O I：

10.1016/j.mee.2004.02.004

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

High aspect ratio microstructures are frequently made with the Lithographie, Galvanoformung, Abformung (LIGA) process. The success of this process depends critically on "deep" X-ray lithography (DXRL). This paper presents a variety of experimentally and analytically determined techniques for optimizing DXRL. These include methods for designing and fabricating high-quality X-ray masks. Methods for optimizing the exposure dosage and developing cycle are described. New methods for promoting resist adhesion and for avoiding resist film cracking are discussed. The influence of developer surface tension on the resist solvation process is quantified and new methods for controlling this surface tension are described. (C) 2004 Elsevier B.V. All rights reserved.

引用

页码：335 / 342

页数：8

共 11 条

[1]

Becker E. W., 1986, Microelectronic Engineering, V4, P35, DOI 10.1016/0167-9317(86)90004-3

[2] Development behaviours and microstructure quality of downward-development in deep x-ray lithography [J].

Cheng, CM ;

Chen, RH .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2001, 11 (06) :692-696

[3] Ultra-deep LIGA process [J].

Cheng, Y ;

Shew, BY ;

Lin, CY ;

Wei, DH ;

Chyu, MK .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1999, 9 (01) :58-63

[4] Dose distribution of synchrotron x-ray penetrating materials of low atomic numbers [J].

Cheng, Y ;

Kuo, NY ;

Su, CH .

REVIEW OF SCIENTIFIC INSTRUMENTS, 1997, 68 (05) :2163-2166

[5]

EHRFELD W, 1994, RAD PHYS CHEM

[6] Inexpensive, quickly producable X-ray mask for LIGA [J].

Harris, C ;

Desta, Y ;

Kelly, KW ;

Calderon, G .

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 1999, 5 (04) :189-193

[7] Adhesion promotion between poly(methylmethacrylate) and metallic surfaces for LiGA evaluated by shear stress measurements [J].

Malek, CGK ;

Das, SS .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (06) :3543-3546

[8]

Pan CT, 1999, SENSOR MATER, V11, P339

[9] Dosage modeling for deep x-ray lithography application [J].

Shih, WP ;

Hwang, GJ ;

Shew, BY ;

Cheng, Y .

MICROSYSTEM TECHNOLOGIES, 1998, 4 (02) :82-85

[10] Ultra-fine machining tool/molds by LIGA technology [J].

Yang, H ;

Pan, CT ;

Chou, MC .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2001, 11 (02) :94-99

← 1 2 →