Resonant cavity enhanced Ge photodetectors for 1550 nm operation on reflecting Si substrates

被引:53
作者
Dosunmu, OI [1 ]
Cannon, DD
Emsley, MK
Ghyselen, B
Liu, JF
Kimerling, LC
Ünlü, MS
机构
[1] Boston Univ, Boston, MA 02215 USA
[2] MIT, Cambridge, MA 02139 USA
[3] Analog Devices Inc, Wilmington, MA 01887 USA
关键词
absorption enhancement; bandgap narrowing; germanium; ion cut; photodetector; resonant cavity; silicon-on-insulator (SOI);
D O I
10.1109/JSTQE.2004.833900
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have fabricated and characterized the first resonant cavity-enhanced germanium photodetectors on double silicon-on-insulator substrates (Ge-DSOI) for operation around the 1550-nm communication wavelength and have demonstrated over four-fold improvement in quantum efficiency compared to its single-pass counterpart. The DSOI substrate is fabricated using an ion-cut process and optimized for high reflectivity (>90%) in the 1300-1600-nm wavelength range, whereas the Ge layer is grown using a novel two-step ultra-high vacuum/chemical vapor deposition direct epitaxial growth technique. We have simulated a Ge-DSOI photodetector optimized for operation at 1550 nm, exhibiting a quantum efficiency of 76% at 1550 nm given a Ge layer thickness of only 860 nm as a result of both strain-induced and resonant cavity enhancement. For this Ge thickness, we estimate a transit time-limited 3-dB bandwidth of approximately 25 GHz.
引用
收藏
页码:694 / 701
页数:8
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