ACTIVATION OF SHALLOW, HIGH-DOSE BF2+ IMPLANTS INTO SILICON BY RAPID THERMAL-PROCESSING

被引:15
作者
POWELL, RA
机构
关键词
D O I
10.1063/1.333818
中图分类号
O59 [应用物理学];
学科分类号
摘要
35
引用
收藏
页码:2837 / 2843
页数:7
相关论文
共 33 条
[11]   RAPID ISOTHERMAL ANNEALING OF BORON ION-IMPLANTED JUNCTIONS [J].
LASKY, JB .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (10) :6009-6018
[12]  
Lau C. K., 1982, International Electron Devices Meeting. Technical Digest, P714
[13]   CHANNELING EFFECT OF LOW-ENERGY BORON IMPLANT IN (100) SILICON [J].
LIU, TM ;
OLDHAM, WG .
IEEE ELECTRON DEVICE LETTERS, 1983, 4 (03) :59-62
[14]  
LIU TM, 1983, P ELECTROCHEM SOC M, V83, P631
[15]   MODELING OF CARRIER MOBILITY AGAINST CARRIER CONCENTRATION IN ARSENIC-DOPED, PHOSPHORUS-DOPED, AND BORON-DOPED SILICON [J].
MASETTI, G ;
SEVERI, M ;
SOLMI, S .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (07) :764-769
[16]  
MYLROIE S, 1973, ION IMPLANATION SEMI, P243
[17]   RAPID THERMAL ANNEALING OF ARSENIC AND BORON-IMPLANTED SILICON [J].
NARAYAN, J ;
HOLLAND, OW ;
EBY, RE ;
WORTMAN, JJ ;
OZGUZ, V ;
ROZGONYI, GA .
APPLIED PHYSICS LETTERS, 1983, 43 (10) :957-959
[18]   FORMATION OF TITANIUM SILICIDE FILMS BY RAPID THERMAL-PROCESSING [J].
POWELL, RA ;
CHOW, R ;
THRIDANDAM, C ;
FULKS, RT ;
BLECH, IA ;
PAN, JDT .
IEEE ELECTRON DEVICE LETTERS, 1983, 4 (10) :380-382
[19]   RANGE PARAMETERS OF BORON IMPLANTED INTO SILICON [J].
RYSSEL, H ;
PRINKE, G ;
HABERGER, K ;
HOFFMANN, K ;
MULLER, K ;
HENKELMANN, R .
APPLIED PHYSICS, 1981, 24 (01) :39-43
[20]   HIGH-CONCENTRATION EFFECTS OF ION-IMPLANTED BORON IN SILICON [J].
RYSSEL, H ;
MULLER, K ;
HABERGER, K ;
HENKELMANN, R ;
JAHNEL, F .
APPLIED PHYSICS, 1980, 22 (01) :35-38