REACTIVE ION ETCHING OF GAAS IN CCL4/H2 AND CCL4/O2

被引:24
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SEMURA, S
SAITOH, H
ASAKAWA, K
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10.1063/1.333311
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O59 [应用物理学];
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页码:3131 / 3135
页数:5
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[11]   REACTIVE-ION ETCHING OF GAAS AND INP USING CCL2F2-AR-O2 [J].
HU, EL ;
HOWARD, RE .
APPLIED PHYSICS LETTERS, 1980, 37 (11) :1022-1024
[12]   REACTIVE ION ETCHING OF GAAS IN CCL2F2 [J].
KLINGER, RE ;
GREENE, JE .
APPLIED PHYSICS LETTERS, 1981, 38 (08) :620-622
[13]   POLYSILICON ETCHING AND PROFILE CONTROL IN A CCL4-O2 PLASMA [J].
KORMAN, CS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 20 (03) :476-479
[14]   RAMAN EFFECT IN CRYSTALS [J].
LOUDON, R .
ADVANCES IN PHYSICS, 1964, 13 (52) :423-&
[15]   PLASMA ETCHING OF SI AND SIO2 - EFFECT OF OXYGEN ADDITIONS TO CF4 PLASMAS [J].
MOGAB, CJ ;
ADAMS, AC ;
FLAMM, DL .
JOURNAL OF APPLIED PHYSICS, 1978, 49 (07) :3796-3803
[16]  
PAZASCZAK J, 1981, J VAC SCI TECHNOL, V19, P1412
[17]   TIME-DEPENDENT ETCHING OF GAAS AND INP WITH CCL4 OR HCL PLASMAS - ELECTRODE MATERIAL AND OXIDANT ADDITION EFFECTS [J].
SMOLINSKY, G ;
GOTTSCHO, RA ;
ABYS, SM .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (06) :3518-3523
[18]   PLASMA-ETCHING OF III-V-COMPOUND SEMICONDUCTOR-MATERIALS AND THEIR OXIDES [J].
SMOLINSKY, G ;
CHANG, RP ;
MAYER, TM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 18 (01) :12-16
[19]   COMPARISON OF ALUMINUM ETCH RATES IN CARBON-TETRACHLORIDE AND BORON-TRICHLORIDE PLASMAS [J].
TOKUNAGA, K ;
REDEKER, FC ;
DANNER, DA ;
HESS, DW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1981, 128 (04) :851-855
[20]   EFFECT OF ADDED HYDROGEN ON THE RF DISCHARGE CHEMISTRY OF CF4, CF3H, AND C2F6 [J].
TRUESDALE, EA ;
SMOLINSKY, G .
JOURNAL OF APPLIED PHYSICS, 1979, 50 (11) :6594-6599