CHEMICAL VAPOR-DEPOSITION OF TUNGSTEN FILMS FOR METALLIZATION OF INTEGRATED-CIRCUITS

被引：27

作者：

PAULEAU, Y

机构：

[1] CNET, Meylan, Fr, CNET, Meylan, Fr

来源：

THIN SOLID FILMS | 1984年 / 122卷 / 03期

关键词：

D O I：

10.1016/0040-6090(84)90051-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：243 / 258

页数：16

共 53 条

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