EFFECT OF BEAM ENERGY AND ANNEAL HISTORY ON TRIVALENTLY BONDED SILICON DEFECT CENTERS INDUCED BY ION-BEAM ETCHING

被引:35
作者
SINGH, R [1 ]
FONASH, SJ [1 ]
CAPLAN, PJ [1 ]
POINDEXTER, EH [1 ]
机构
[1] USA,ELECTR TECHNOL & DEVICES LAB,FT MONMOUTH,NJ 07703
关键词
D O I
10.1063/1.94367
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:502 / 504
页数:3
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[1]   MODIFICATION OF SCHOTTKY BARRIERS IN SILICON BY REACTIVE ION ETCHING WITH NF3 [J].
ASHOK, S ;
CHOW, TP ;
BALIGA, BJ .
APPLIED PHYSICS LETTERS, 1983, 42 (08) :687-689
[2]   ELECTRON SPIN RESONANCE IN AMORPHOUS SILICON, GERMANIUM, AND SILICON CARBIDE [J].
BRODSKY, MH ;
TITLE, RS .
PHYSICAL REVIEW LETTERS, 1969, 23 (11) :581-&
[3]   ESR CENTERS, INTERFACE STATES, AND OXIDE FIXED CHARGE IN THERMALLY OXIDIZED SILICON WAFERS [J].
CAPLAN, PJ ;
POINDEXTER, EH ;
DEAL, BE ;
RAZOUK, RR .
JOURNAL OF APPLIED PHYSICS, 1979, 50 (09) :5847-5854
[4]   EFFECT OF NEUTRAL ION-BEAM SPUTTERING AND ETCHING ON SILICON [J].
FONASH, SJ ;
ASHOK, S ;
SINGH, R .
THIN SOLID FILMS, 1982, 90 (03) :231-235
[5]   EFFECT OF ION-BEAM SPUTTER DAMAGE ON SCHOTTKY-BARRIER FORMATION IN SILICON [J].
FONASH, SJ ;
ASHOK, S ;
SINGH, R .
APPLIED PHYSICS LETTERS, 1981, 39 (05) :423-425
[6]   TECHNOLOGY AND APPLICATIONS OF BROAD-BEAM ION SOURCES USED IN SPUTTERING .2. APPLICATIONS [J].
HARPER, JME ;
CUOMO, JJ ;
KAUFMAN, HR .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 21 (03) :737-756
[7]   DEUTERIUM PASSIVATION OF GRAIN-BOUNDARY DANGLING BONDS IN SILICON THIN-FILMS [J].
JOHNSON, NM ;
BIEGELSEN, DK ;
MOYER, MD .
APPLIED PHYSICS LETTERS, 1982, 40 (10) :882-884
[8]   RADIATION-INDUCED TRIVALENT SILICON DEFECT BUILDUP AT THE SI-SIO2 INTERFACE IN MOS STRUCTURES [J].
LENAHAN, PM ;
BROWER, KL ;
DRESSENDORFER, PV ;
JOHNSON, WC .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1981, 28 (06) :4105-4106
[9]   DAMAGE INDUCED IN SI BY ION MILLING OR REACTIVE ION ETCHING [J].
PANG, SW ;
RATHMAN, DD ;
SILVERSMITH, DJ ;
MOUNTAIN, RW ;
DEGRAFF, PD .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (06) :3272-3277
[10]   INTERFACE STATES AND ELECTRON-SPIN RESONANCE CENTERS IN THERMALLY OXIDIZED (111) AND (100) SILICON-WAFERS [J].
POINDEXTER, EH ;
CAPLAN, PJ ;
DEAL, BE ;
RAZOUK, RR .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (02) :879-884