COPPER ELECTROMIGRATION IN ALUMINUM

被引：41

作者：

BLECH, IA ^{[1
]}

机构：

[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974

来源：

JOURNAL OF APPLIED PHYSICS | 1977年 / 48卷 / 02期

关键词：

D O I：

10.1063/1.323689

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

收藏

页码：473 / 477

页数：5

相关论文

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[9] HILLOCKS AS STRUCTURAL MARKERS FOR ELECTROMIGRATION RATE MEASUREMENTS IN THIN FILMS
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