PREPARATION AND CHARACTERIZATIONS OF AL3TA INTERMETALLIC COMPOUND FILMS

被引：7

作者：

SASAKI, K

NOYA, A

UMEZAWA, T

机构：

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1988年 / 27卷 / 07期

关键词：

D O I：

10.1143/JJAP.27.1190

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1190 / 1192

页数：3

共 6 条

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[2] INTERMETALLIC COMPOUNDS OF AL AND TRANSITIONS METALS - EFFECT OF ELECTROMIGRATION IN 1-2-MUM-WIDE LINES
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[3] COSPUTTERED ALUMINUM-RICH ALTA ALLOY FILMS
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[4] ELECTRICAL AND STRUCTURAL PROPERTIES OF CO-SPUTTERED TANTALUM-ALUMINUM FILMS
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[5] HIGH-TEMPERATURE CONTACT STRUCTURES FOR SILICON SEMICONDUCTOR-DEVICES
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[J]. APPLIED PHYSICS LETTERS, 1980, 37 (06) : 540 - 542
[6] BARRIER LAYERS - PRINCIPLES AND APPLICATIONS IN MICROELECTRONICS
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1984, 2 (02): : 273 - 280